Internal Die Verification

 

 

Decapsulation inspection is a process of verifying the manufacturer die to ensure that it is the correct one.  This considers being a destructive test.  At Global Electronics Testing Services we have many different methods to expose the die.  Once the die exposed the attributes of the die, such as die markings, metallization damage due to ESD or corrosion will be verify.  Decapsulation is performing on 1 sample per lot code or date code base on MIL-STD-883, Method 2014.

 

Decapsulation Process Explained

This is a process used to expose the internal structure of a integrated circuit. The decap process is completed using a mixture of 98% fuming Nitric acid and 20% fuming Sulfuric acid heated to a certain temperature. This mixture is the forced into a small hole in a gasket to etch away polymer encapsulants or exterior of a device using a Nisene Technologies Jetetch Pro decapsulation machine. This creates a cavity in a device exposing bonding wires, internal structure, and the die.

There are many terms used for this process in electronic components industry. Some of the terms used are Decapsulation, Decap, De-Lid, Expose Die, Internal Die Verification, and Internal Inspection

  • Below is an example of what a device looks like before the decapsulation process.
This image is the top view of an Actel A40MX04-F device
top view of an Actel A40MX04-F device
This is the bottom view of an Actel A40MX04-F device
bottom view of an Actel A40MX04-F device
Device is put inside a Nisene Jetetch Pro machine to chemically etch a small cavity inside the Actel A40MX04-F device to expose die
After de-lid process is completed you will see bond wires and die located in the midle of this device
bond wires and die located in the midle of this device
This image is a size comparison of a device and internal die
size comparison of a device and internal die
Markings on the die are not visible without a microscope. The sample is then placed under our Amscope microscope to locate any markings there may be on die
Markings on the die are not visible without a microscope
This is a close-up of internal die under a microscope
After the die is exposed, the device is put under a microscope to see if the Manufacturer logo and any markings are visible
Manufacturer logo and any markings are visible
When the manufacture logo and markings are found. Markings are then compared to G.E.T.S. internal database of known good parts. Sometimes the die numbers and markings can be confirmed with the devices external markings. This is a close-up under microscopy of the die logo and markings for Actel A40MX04-F device
die logo and markings for Actel A40MX04-F device
Here are a few more examples of devices that have been decapsulated

Before Decapsulation

Die Topography

Die Markings

     

Before Decapsulation

Die Topography

Die Markings